| ADAQ | Body Length | 1.060 inches maximum |
| ADAT | Body Width | 0.220 inches minimum and 0.310 inches maximum |
| ADAU | Body Height | 0.130 inches minimum and 0.185 inches maximum |
| AEHX | Maximum Power Dissipation Rating | 275.0 milliwatts |
| AFGA | Operating Temp Range | -55.0/+125.0 deg celsius |
| AFJQ | Storage Temp Range | -65.0/+150.0 deg celsius |
| CBBL | Features Provided | Hermetically sealed and monolithic and 3-STATE output and low power |
| CQSJ | Inclosure Material | Ceramic |
| CQSZ | Inclosure Configuration | Dual-in-line |
| CQWX | Output Logic Form | Transistor-transistor logic |
| CQZP | Input Circuit Pattern | 10 input |
| CSSL | Design Function and Quantity | 8 buffer, inverting |
| CTFT | Case Outline Source and Designator | D-8 MIL-M-38510 |
| CWSG | Terminal Surface Treatment | Solder |
| CZEN | Voltage Rating and Type per Characteristic | -0.5 volts minimum power source and 7.0 volts maximum power source |
| CZEQ | Time Rating per Chacteristic | 18.00 nanoseconds maximum propagation delay time, low to high level output and 23.00 nanoseconds maximum propagation delay time, high to low level output |
| TTQY | Terminal Type and Quantity | 20 printed circuit |