5962-01-104-4187 (5962011044187) NSN Information
| NSN | FSC | NIIN | Item Name | INC |
|---|---|---|---|---|
| 5962-01-104-4187 | 5962 | 011044187 | Microcircuit, Memory | 41015 |
5962-01-104-4187 Features
| MRC | Parameter | Characteristics |
|---|---|---|
| ADAQ | Body Length | 0.740 inches minimum and 0.810 inches maximum |
| ADAT | Body Width | 0.220 inches minimum and 0.310 inches maximum |
| ADAU | Body Height | 0.175 inches maximum |
| AFGA | Operating Temp Range | -55.0 to 125.0 deg celsius |
| AFJQ | Storage Temp Range | -65.0 to 150.0 deg celsius |
| CBBL | Features Provided | Monolithic and bipolar and programmable and W/open collector |
| CQSJ | Inclosure Material | Ceramic |
| CQSZ | Inclosure Configuration | Dual-in-line |
| CQWX | Output Logic Form | Transistor-transistor logic |
| CQZP | Input Circuit Pattern | 10 input |
| CWSG | Terminal Surface Treatment | Solder |
| CZEN | Voltage Rating and Type per Characteristic | 5.5 volts maximum power source |
| CZEQ | Time Rating per Chacteristic | 25.00 nanoseconds maximum propagation delay time, low to high level output and 25.00 nanoseconds maximum propagation delay time, high to low level output |
| CZER | Memory Device Type | ROM |
| TTQY | Terminal Type and Quantity | 16 printed circuit |
5962-01-104-4187 Manufacturing Part Numbers (SKUs)
| MFG SKU | CAGE | STATUS | ISC | RNVC | RNCC | SADC | DAC | HCC | RNAAC |
|---|---|---|---|---|---|---|---|---|---|
| 15-1216657-60 | 07397 | A | 1 | 5 | HD | ||||
| 15-1217965-202 | 07397 | A | 9 | 3 | HD | ||||
| 5300-1J | 50364 | F | 1 | 5 | HD | ||||
| 82S126 | 18324 | F | 9 | 5 | HD | ||||
| ROM/PROM FAMILY 021 | 16236 | A | 1 | 5 | TX |
5962-01-104-4187 Manufacturer
| MFG SKU | CAGE | Manufacturer | Type | Status | Role |
|---|---|---|---|---|---|
| ROM/PROM FAMILY 021 | 16236 | DLA Land and Maritime | H | A | |
| 15-1216657-60 | 07397 | General Dynamics Advanced | A | A | |
| 15-1217965-202 | 07397 | General Dynamics Advanced | A | A | |
| 5300-1J | 50364 | MMI/AMD | A | F | |
| 82S126 | 18324 | Philips Semiconductors Inc. | A | F |
5962-01-104-4187 FLIS Identification
| PMIC | ADPE CODE | CRITL CODE | DEMIL CODE | DEMIL INTG | NIIN ASGMT | ESD | HMIC | ENAC | SCHEDULE_B | INC |
|---|---|---|---|---|---|---|---|---|---|---|
| A | 0 | X | Q | 04-DEC-1980 | B | N | 8542900000 | 41015 |
5962-01-104-4187 FLIS Management
| MOE | REC REP CODE | MGMT CTL | USC | PHRASE CODE | PHRASE STATEMENT |
|---|---|---|---|---|---|
| DS | ------- | I |
5962-01-104-4187 Demilitarization Codes & Management
| DML | PMIC | HMIC | ADPEC | Criticality | ESDC |
|---|---|---|---|---|---|
| Q | N | 0 | X | B |
5962-01-104-4187 Miscellaneous Management
| MOE (S_A) | SOS | AAC | QUP | UI | SLC | CIIC | RC | MCC | SVC |
|---|---|---|---|---|---|---|---|---|---|
| DS | SMS | Z | 1 | EA | 0 | U | ------- | I |
5962-01-104-4187 Non-consumable Item Support
| MOE RULE | NIMSC | DSOR |
|---|---|---|
| DGX1 | ||
| ZG01 |
5962-01-104-4187 Freight
| NMFC | NMFC SUB | UFC | HMC | LTL | LCL | WCC | TCC | SHC | ADC | ACC | ASH | NMF DESC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 061045 | Z | 34580 | W | 72D | 3 | 9 | A | HZ |
5962-01-104-4187 FLIS Packaging 1
| PICA SICA | TOS | ICQ | MOP | CLNG DRYING | PRES MAT | WRAP MAT | PKG CAT | PKG DESIGN ACTY | CUSH DUN |
|---|---|---|---|---|---|---|---|---|---|
| P | AAA | GX | 1 | 00 | ZZ | 69F0 | ZZ |
5962-01-104-4187 FLIS Packaging 2
| THK | UNIT CONT | PKG DATA SOURCE | INTER CONT | UCL | SPC MKG | LVL A | LVL B | LVL C |
|---|---|---|---|---|---|---|---|---|
| C | ZZ | P | ZZ | Q | Q | U |
5962-01-104-4187 FLIS Packaging 3
| UNIT PACK WEIGHT | UNIT PACK SIZE | UNIT PACK CUBE | CONT NSN | OPI | UNPKG ITEM DIM | UNPKG ITEM WEIGHT | SPI DATE | SPI NO | SPI REV | SUPPL INSTR |
|---|---|---|---|---|---|---|---|---|---|---|
| 0000.1 | 0000.007 | M | UNIT PACKAGE MARKING REQUI |