| ADAQ | Body Length | 0.660 inches minimum and 0.785 inches maximum |
| ADAT | Body Width | 0.220 inches minimum and 0.280 inches maximum |
| ADAU | Body Height | 0.140 inches minimum and 0.180 inches maximum |
| AEHX | Maximum Power Dissipation Rating | 312.0 milliwatts |
| AFGA | Operating Temp Range | -55.0/+125.0 deg celsius |
| AFJQ | Storage Temp Range | -65.0/+150.0 deg celsius |
| CBBL | Features Provided | Monolithic and hermetically sealed and W/open collector and high voltage and positive outputs |
| CQSJ | Inclosure Material | Ceramic and glass |
| CQSZ | Inclosure Configuration | Dual-in-line |
| CQWX | Output Logic Form | Transistor-transistor logic |
| CQZP | Input Circuit Pattern | Hex 1 input |
| CSSL | Design Function and Quantity | 6 buffer, inverting and 6 driver, inverting |
| CTFT | Case Outline Source and Designator | T0-116 joint electron device engineering council |
| CZEQ | Time Rating per Chacteristic | 15.00 nanoseconds maximum propagation delay time, low to high level output and 23.00 nanoseconds maximum propagation delay time, high to low level output |
| TEST | Test Data Document | 94117-310350 specification (includes engineering type bulletins, brochures, etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type data on certain environmental and performance requirements and test conditions that are shown as "typical", "average", "nominal", etc.). |