| ADAR | Body Outside Diameter | 0.335 inches minimum and 0.370 inches maximum |
| ADAU | Body Height | 0.165 inches minimum and 0.185 inches maximum |
| AEHX | Maximum Power Dissipation Rating | 81.0 milliwatts |
| AFGA | Operating Temp Range | -55.0/+125.0 deg celsius |
| AFJQ | Storage Temp Range | -65.0/+150.0 deg celsius |
| CBBL | Features Provided | Hermetically sealed and monolithic and medium power and medium speed and positive outputs and asynchronous and synchronous and W/buffered output and edge triggered and W/clear and resettable |
| CQSJ | Inclosure Material | Glass and metal |
| CQSZ | Inclosure Configuration | CAN |
| CQWX | Output Logic Form | Diode-transistor logic |
| CQZP | Input Circuit Pattern | 7 input |
| CSSL | Design Function and Quantity | 1 flip-flop, J-K/R-S, clocked, master slave |
| CTFT | Case Outline Source and Designator | T0-100 joint electron device engineering council |
| CWSG | Terminal Surface Treatment | Solder |
| CZEN | Voltage Rating and Type per Characteristic | -1.5 volts minimum power source and 5.5 volts maximum power source |
| CZEQ | Time Rating per Chacteristic | 65.00 nanoseconds maximum propagation delay time, low to high level output and 75.00 nanoseconds maximum propagation delay time, high to low level output |
| PMLC | Precious Material and Location | Terminal surface gold |
| PRMT | Precious Material | GOLD |
| TEST | Test Data Document | 15786-84110 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing) |
| TTQY | Terminal Type and Quantity | 10 pin |