| AAQL | Body Style | Chip type |
| AARG | Reliability Indicator | Established |
| AARH | Reliability Failure Rate Level in Percent | 0.010 |
| ABJT | Terminal Length | 0.015 inches nominal |
| ADAQ | Body Length | 0.110 inches nominal |
| ADAT | Body Width | 0.110 inches nominal |
| ADAU | Body Height | 0.030 inches minimum and 0.102 inches maximum |
| AEBZ | Schematic Diagram Designator | No common or grounded electrode(s) |
| CQBF | Insulation Resistance at Maximum Operating Temp | 100000.0 megohms |
| CQBQ | Capacitance Value per Section | 6.200 picofarads single section |
| CQJJ | Nonderated Operating Temp | -55.0 deg celsius minimum and 125.0 deg celsius maximum |
| CQLZ | Temp Coefficient of Capacitance per Section in PPM per DEG Celsius | 90.0 single section |
| CQWM | Nonderated Continuous Voltage Rating and Type per Section | 500.0 dc single section |
| CRHD | Tolerance of Temp Coefficient per Section in PPM per DEG Celsius | -20.0/+20.0 single section |
| CRTP | Tolerance Range per Section | -0.25 to 0.25 picofarads single section |
| CWJK | Case Material | Ceramic or glass |
| CWPK | Insulation Resistance at Reference Temp | 1000000.0 megohms |
| CWPM | Dissipation Factor at Reference Temp in Percent | 0.050 |
| CWQF | Quality Factor at Reference Temp | 10000.000 |
| CWSG | Terminal Surface Treatment | Palladium and silver |
| PMLC | Precious Material and Location | Terminal surfaces palladium and terminal surfaces silver |
| TEST | Test Data Document | 81349-MIL-C-55681 specification (includes engineering type bulletins, brochures, etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type data on certain environmental and performance requirements and test conditions that are shown as "typical", "average", "nominal", etc.). |
| TTQY | Terminal Type and Quantity | 2 bonding pad |
| ZZZK | Specification/Standard Data | 81349-MIL-C-55681/4 government specification |